GPVOUS
BERGQUIST GAP PAD TGP 1000VOUS Formerly known as GAP PAD VO Ultra Soft
Product ID: GPVOUS
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BERGQUIST GAP PAD TGP 1000VOUS Formerly known as GAP PAD VO Ultra Soft
Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture-, shear- and tear-resistant
• Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring
isolation between heat sinks and high-voltage, bare-leaded devices.
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs
Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Decreased strain
• Puncture-, shear- and tear-resistant
• Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring
isolation between heat sinks and high-voltage, bare-leaded devices.
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs
Main Products
Thermal insulation material for Bergquist