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Bonding examination equipment: large C-Scan

Bonding examination equipment: large C-Scan

Sputtering target bonding

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Unique metallization wetting process for material bonding which is an optimized method for large size sputtering target. We have uniform heating plate, flatness equipment, ultrasonic tester and transportation equipment to meet vary TFT-LCD generations.

Services

  • Target bonding for metal, oxide-based and brittle materials.

Main Products

Thin film sputtering tube/ plate target, metal powder for 3D printing, acid and alkali-resistance alloy and titanium for cooking/ tableware. Sputtering target bonding, precious metal recycling, Vacuum hot pressing sintering, forging and analysis

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