High Density Mobile PCB
Specifications
- Multi-layer
- Thickness: 0.1mm to 3.0mm
- Min. track width/ space: 0.1mm
- Min. drilled hole size: 0.1mm
Main Products
PCB/FPC design,manufacture,SMT/DIP(OEM/ODM)
PCB/FPC design,manufacture,SMT/DIP(OEM/ODM)