TFUER-T315
* Solder Pallet Materials
T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance.
* Solder Pallet Materials
T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance.
Main Products
G10, FR4, Solder Pallet Materials, Bakelite, Hold-downs