1. Low profile surface mounted application in order to optimize board space.
2. High current capability.
3. High Surge capability.
4. Glass passivated chip junction inside.
5. Lead-free parts meet environmental standards of MIL-STD-19500 / 228.
2. High current capability.
3. High Surge capability.
4. Glass passivated chip junction inside.
5. Lead-free parts meet environmental standards of MIL-STD-19500 / 228.
Main Products
Bridge Diodes, Low VF Rectifiers, Schottky Diodes, TVS, Zener Chips