HOT SALE CHINAFIX CF160 infrared motherboard repair station equipment machine/chips repair for laptop
Product ID: BGA rework station
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Power supply:AC 220V/50-60HZ
Heating Method:Two-side infrared heating
Demension:Lmm360*Wmm520*H430mm
Maximum Power:2.3KW
PCB size:405mm*310mm
Heating controlled independently:Yes
Upper heating control method:High-precision closed-loop control, instrument error is about 0.5%
Upper temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)
Bottom heating control method:High-precision closed-loop control, instrument error is about 0.5%
Bottom temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)
Application type:Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.
Suitable chip size:less than 50mm
Heating Method:Two-side infrared heating
Demension:Lmm360*Wmm520*H430mm
Maximum Power:2.3KW
PCB size:405mm*310mm
Heating controlled independently:Yes
Upper heating control method:High-precision closed-loop control, instrument error is about 0.5%
Upper temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)
Bottom heating control method:High-precision closed-loop control, instrument error is about 0.5%
Bottom temperature control and measuring method:High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)
Application type:Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.
Suitable chip size:less than 50mm
Certificate
- CE ROSH
Main Products
BGA rework station