Encapsulation materials:PVC, ABS,PU outer covering with embedded chip and coils for multiple-purpose applicationsChip Types:EM4100,EM4200,EM4305,EM4450,TK4100,Mifare1 s50,Mifare1 s70,Mifare Ultralight 10,ICODE2,DESFire41,TI2048,TI256,Hitag2,Hitags,T5577...
Inquiry Now
Main Products:
Registered Capital:RMB 1, 000, 000...
more