Homray Material Technology
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.

Company Profile

  • Factory Location
    LiSheng Industrial Building,60
  • Business types
    • OEM Manufacturer
  • Markets
      North America / South America / Caribbean / West Europe / East Europe / Russia / East Asia / Southeast Asia / Australia / New Zealand / China / Hong Kong